RDLs enable high-density interconnects and power delivery for AI, 5G, and automotive chips. These copper networks replace wire bonds, offering better speed and reliability. Critical for modern electronics.
Roller coating: Precise, efficient paint/adhesive application. Used in auto, packaging, electronics. Offers ±0.1mm accuracy, 45% lower emissions than spraying. Types: direct/reverse/gravure. Low waste, smart IoT options.
Slot die coating enables precise, uniform thin-film deposition for industries like electronics and energy. It’s efficient, scalable, and eco-friendly, with future trends like AI and sustainable materials.
Advanced semiconductor packaging boosts performance, efficiency, and miniaturization. Key technologies like 3D packaging and chiplets drive AI, IoT, and HPC. Future trends include AI-driven design and sustainability.
