你瀏覽的是我們在Google的加速版網頁,你可以點選Logo回到主網站取得更多的資訊

Slot Die Coating: The Ultimate Precision Solution for Modern Industries

Slot die coating enables precise, uniform thin-film deposition for industries like electronics and energy. It’s efficient, scalable, and eco-friendly, with future trends like AI and sustainable materials.

Semiconductor Packaging: The Evolution and Future of Advanced Packaging Technology

Advanced semiconductor packaging boosts performance, efficiency, and miniaturization. Key technologies like 3D packaging and chiplets drive AI, IoT, and HPC. Future trends include AI-driven design and sustainability.